W25X16, W25X16A, W25X32, W25X64
Table of Contents
1.
2.
3.
4.
5.
6.
7.
8.
9.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
PAD CONFIGURATION WSON 6X5-MM & 8X6-MM ................................................................ 5
PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6
PIN DESCRIPTION SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5 / 8X6-MM ..................... 6
PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
9.1
9.2
9.3
9.4
9.5
9.6
9.7
Package Types ............................................................................................................... 8
Chip Select (/CS) ............................................................................................................ 8
Serial Data Output (DO) ................................................................................................. 8
Write Protect (/WP)......................................................................................................... 8
HOLD (/HOLD) ............................................................................................................... 8
Serial Clock (CLK) .......................................................................................................... 8
Serial Data Input / Output (DIO) ..................................................................................... 8
10.
11.
BLOCK DIAGRAM ...................................................................................................................... 9
FUNCTIONAL DESCRIPTION ................................................................................................. 10
11.1
SPI OPERATIONS ....................................................................................................... 10
11.1.1
11.1.2
11.1.3
SPI Modes ....................................................................................................................10
Dual Output SPI............................................................................................................10
Hold Function ...............................................................................................................10
11.2
WRITE PROTECTION.................................................................................................. 11
11.2.1
Write Protect Features..................................................................................................11
12.
CONTROL AND STATUS REGISTERS................................................................................... 12
12.1
STATUS REGISTER .................................................................................................... 12
12.1.1
12.1.2
12.1.3
12.1.4
12.1.5
12.1.6
12.1.7
BUSY............................................................................................................................12
Write Enable Latch (WEL) ............................................................................................12
Block Protect Bits (BP2, BP1, BP0)..............................................................................12
Top/Bottom Block Protect (TB).....................................................................................12
Reserved Bits ...............................................................................................................12
Status Register Protect (SRP) ......................................................................................13
Status Register Memory Protection ..............................................................................14
12.2
INSTRUCTIONS........................................................................................................... 16
12.2.1
Manufacturer and Device Identification.........................................................................16
-2-
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